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In situ polymerization injection molding system

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  • Release time:2018-08-29

  • School Sign:是

  • Patent Applicant:中南大学

  • Disigner of the Invention:刘毅等, 吴旺青

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:201721700507.3

  • Service Invention or Not:yes

  • Authorization Date:2018-07-03

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