DOI number:10.1109/TII.2020.2972332

Journal:IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS

Volume:16

Issue:11

Page Number:7056-7066

Translation or Not:no

Included Journals:SCI

Pre One:A Novel 3-D High-Temperature Industrial Endoscope With Large Field Depth and Wide Field Next One:Classification of silicon content variation trend based on fusion of multilevel features in blast furnace ironmaking