Evolution of microstructure and properties of an ultrahigh strength Cu–Ni–Sn alloy with low Sn content during the multi-stage thermomechanical treatment

Release time:2026-09-11

Impact Factor:7.9

DOI number:10.1016/j.msea.2023.144933

Affiliation of Author(s):中南大学材料科学与工程学院

Journal:Materials Science and Engineering: A

Key Words:A low Sn-Content Cu-Ni-Sn alloy

Abstract:An ultrahigh strength Cu-9Ni-1.5Sn-0.8Si-0.1Al alloy was designed. The effect of multi-stage thermomechanical treatment on the evolution of the microstructure and the properties of designed alloy is explored. The alloy treated by cold rolled (60%)-pre-aging (400 °C/30 min)-cold rolled (50%)-450 °C/120 min-cold rolled (50%)-330 °C/120 min had a tensile strength of 1150 MPa and remained electrical conductivity of 18.1 %IACS. Nanoscale β′-Ni3Sn, β-Ni3Si, γ′-Ni3Al precipitates formed during the thermomechanical treatment.

Co-author:Gan Xueping, Xiao Zhu, Jia Yanlin, Qiu Wenting, Meng Xiangpeng, Zhang Yi, Xiao Lairong, Sun Gai, Zhang Tianyi

First Author:Zhang Yufang

Discipline:Engineering

First-Level Discipline:Materials Science and Engineering

Volume:872

Page Number:144933

ISSN No.:0921-5093

Translation or Not:no

Date of Publication:2023-05-01