Evolution of microstructure and properties of an ultrahigh strength Cu–Ni–Sn alloy with low Sn content during the multi-stage thermomechanical treatment
发布时间：2026-09-11
点击次数：
- 影响因子：
- 7.9
- DOI码：
- 10.1016/j.msea.2023.144933
- 所属单位：
- 中南大学材料科学与工程学院
- 发表刊物：
- Materials Science and Engineering: A
- 关键字：
- A low Sn-Content Cu-Ni-Sn alloy
- 摘要：
- An ultrahigh strength Cu-9Ni-1.5Sn-0.8Si-0.1Al alloy was designed. The effect of multi-stage thermomechanical treatment on the evolution of the microstructure and the properties of designed alloy is explored. The alloy treated by cold rolled (60%)-pre-aging (400 °C/30 min)-cold rolled (50%)-450 °C/120 min-cold rolled (50%)-330 °C/120 min had a tensile strength of 1150 MPa and remained electrical conductivity of 18.1 %IACS. Nanoscale β′-Ni3Sn, β-Ni3Si, γ′-Ni3Al precipitates formed during the thermomechanical treatment.
- 合写作者：
- Gan Xueping, Xiao Zhu, 贾延琳, Qiu Wenting, Meng Xiangpeng, Zhang Yi, Xiao Lairong, Sun Gai, Zhang Tianyi
- 第一作者：
- Zhang Yufang
- 学科门类：
- 工学
- 一级学科：
- 材料科学与工程
- 卷号：
- 872
- 页面范围：
- 144933
- ISSN号：
- 0921-5093
- 是否译文：
- 否
- 发表时间：
- 2023-05-01