中文

Multi domain energy transfer and bond formation in the thin chip stack interconnection

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  • Release time:2016-04-09

  • Affiliation of Participant(s):Central South University

  • Status:Completed

  • Supported by:Ministry of Science and Technology

  • Type of Research Outcome:Thesis

  • Classification of Project:National Basic Research Program of China(973 program)

  • Project Number:2009CB724203

  • Classification of Disciplines:机械工程

  • Date of Project Completion:2013-12-30

  • Date of Project Initiation:2009-01-01


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