中文

Thermoacoustic flip-chip bonding method of copper salient points

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  • Release time:2016-04-09

  • Affilication of Author(s):School of Mechanical and Electronical Engineering

  • School Sign:Central South University

  • Patent Applicant:李军辉

  • Disigner of the Invention:李军辉

  • Patent description:本发明公开了一种铜凸点热声倒装键合方法,在IC芯片焊盘(6)上通过铜线键合方法制作多个铜凸点(2),将带有铜凸点(2)的芯片(3)倒扣于基板(1)上,从芯片(3)上施加超声能(5)和压力(4),从基板(1)底上施加热能(8),完成铜凸点的热声倒装键合。或在基板焊盘(7)上通过铜线键合方法制作多个铜凸点(2),将芯片(3)置于铜凸点(2)上,从芯片(3)上施加超声能(5)和压力(4),从基板(1)底上施加热能(8),完成铜凸点的热声倒装键合,超声能为110-200mA/凸点、压力为50-80g/凸点、热能为

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Application Number:2010105839857

  • Authorization number:CN102082106B

  • Number of Inventors:7

  • Service Invention or Not:no

  • Application Date:2010-12-13

  • Authorization Date:2012-04-25

  • First Author:李军辉


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