中文

A kind of test head and its realization method used for wafer level packaging chip automatic detectio

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  • Release time:2016-04-09

  • Affilication of Author(s):School of Mechanical and Electronical Engineering

  • School Sign:Central South University

  • Patent Applicant:李军辉

  • Disigner of the Invention:李军辉

  • Patent description:该用于晶圆级封装芯片自动检测的测试头及其实现方法,基于阵列探针测试模式,能有效提高晶圆级封装芯片的测试效率。

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Application Number:201210067391X

  • Authorization number:CN102539852B

  • Service Invention or Not:no

  • Application Date:2012-03-14

  • Authorization Date:2015-07-29

  • First Author:李军辉


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