中文

Hot ultrasonic flip chip bonding machine automatically

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  • Release time:2016-04-13

  • Affilication of Author(s):School of Mechanical and Electronical Engineering

  • School Sign:Central South University

  • Patent Applicant:李军辉

  • Disigner of the Invention:李军辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL 200610031493.0

  • Number of Inventors:6

  • Service Invention or Not:no


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