一种无需测厚的晶粒尺寸超声无损评价方法
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Release time:2017-12-19 Patent Applicant:中南大学 Disigner of the Invention:刘希玲, 杨岳, 刘锋, 司家勇, 胡宏伟, 倪培君, 高广军, 田红旗, 宋永锋, 李雄兵 Type of Patent:Invent State of Patent:Authorized patents Authorization number:ZL201410478957.7 Service Invention or Not:no Authorization Date:2017-05-02 -
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