Language : English
唐思危

Research Focus

电子封装用锡基焊粉-锡银铜

  • 焊粉制备
    Synthesis and Morphological Control of Sn-Based SAC Solder Powders
    锡银铜焊粉的制备方法与形貌调控技术研究

  • 焊粉表面改性
    Surface Modification Strategies for Enhanced Stability of SAC Solder Powders
    提升锡基焊粉界面活性与储存稳定性的表面改性方法研究

  • 焊点组织结构演变
    Microstructural Evolution of SAC Solder Joints during Reflow and Aging
    锡银铜焊点在回流与服役过程中的组织演化行为研究

  • 焊点抗氧化特性
    Oxidation Resistance and Environmental Stability of SAC Solder Joints
    锡基焊点的抗氧化性能及其热环境稳定性分析