电子封装用锡基焊粉-锡银铜

• 焊粉制备
  → Synthesis and Morphological Control of Sn-Based SAC Solder Powders
  锡银铜焊粉的制备方法与形貌调控技术研究

• 焊粉表面改性
  → Surface Modification Strategies for Enhanced Stability of SAC Solder Powders
  提升锡基焊粉界面活性与储存稳定性的表面改性方法研究

• 焊点组织结构演变
  → Microstructural Evolution of SAC Solder Joints during Reflow and Aging
  锡银铜焊点在回流与服役过程中的组织演化行为研究

• 焊点抗氧化特性
  → Oxidation Resistance and Environmental Stability of SAC Solder Joints
  锡基焊点的抗氧化性能及其热环境稳定性分析