面向新一代电子封装的先进互连材料体系研究

1.高熵合金焊料

High-Entropy Alloy Solders for Enhanced Thermal and Mechanical Reliability
高熵合金焊料的热稳定性与力学可靠性研究

2.复合焊料材料
Composite Solder Systems with Tailored Interfacial and Functional Properties
具有界面与功能协同调控特性的复合焊料体系研究

3.纳米晶银材料
Nanocrystalline Silver for Low-Temperature, High-Performance Interconnection Applications
面向低温高性能互连的纳米晶银材料设计与性能调控