王彦

副教授 硕士生导师

入职时间:2016-06-02

所在单位:机电工程学院

性别:女

联系方式:wangyancumt@163.com

在职信息:在职

   

个人简介

王彦,博士,中南大学副教授,硕士生导师 email:wangyancumt@163.com


研究方向:
 仿真和优化:多物理场计算,传热传质模型,CFD,计算流体动力学,参数估计,非线性优化等
 微结构制造:微结构表征,微结构电化学沉积,微结构刻蚀等
 微电子可靠性:封装互连,下填料流动分析,传热传质分析等

2019-目前 中南大学机电工程学院 副教授

2016 -2019 中南大学机电工程学院 讲师
2011.09-2015.11 德国TU-Freiberg 热加工工程、环境与天然产物加工工程所 过程工程 攻读博士学位
2008.09-2011.06 浙江大学 (免试研究生) 化工过程机械专业 工学硕士
2004.09-2008.06 中国矿业大学 过程装备与控制工程 工学学士


目前,主持国家自科基金青年基金1项,中国博士后面上基金1项,省自科基金1项,及国家重点实验室自主研究课题1项;参与研究国家973课题1项以及国家自科基金面上项目1项。近年来共发表SCI论文20余篇,近五年以来以第一/通讯作者发表SCI论文15篇,其中在SCI一区TOP期刊Electrochimica Acta(IF 5.116)发表有关微通孔电沉积模型的相关研究内容1篇,在Separation and Purification Technology(SCI一区,IF 5.107)发表有关多尺度流体流动及传质动态数学模型文章多篇,申请国家专利7项。
硕士招生:电子、机电、信息及其他相关专业 联系方式:wangyancumt@163.com 

主要发表论文:

(1) Y. Wang, W. Zhu, X. Li, F. Wang, Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives, Electrochimica Acta, 221(2016) 70-79. (Top, IF: 5.383)(TOP,中科院一区)
(2) Y. Wang*, V. Herdegen and J. U. Repke, Numerical study of different particle size distribution for modeling of solid-liquid extraction in randomly packed beds. Separation and Purification Technology, 2016. 171: 131-143.(IF: 5.107)(中科院二区,JCR一区)
(3) Y. Wang, V. Herdegen, X. Li, and J. Repke, Numerical study and evaluation of solid-liquid extraction of Montan wax in stirred tanks on different scales, Sep. Purif. Technol. 204 (2018) 90-97. (IF: 5.107)(中科院二区,JCR一区)
(4) Y. Wang, X Deng, X Ren, X Li, F Wang and W Zhu (2018). "Parameters determination for modelling of copper electrodeposition in through-silicon-via with additives." Microelectronic Engineering 196: 25-31. (IF: 2.020)(中科院三区,JCR二区)
(5) Y. Wang*, V. Herdegen and J. Repke, Identification and Analysis of Mass Transfer Coefficients and Effective Diffusion Coefficients for Models of Solvent Extraction of Montan Wax. Separation Science and Technology, 2016. 51(13): p. 2183-2197 (IF=1.171)(中科院四区,JCR三区)
(6) Y. Wang*, V. Herdegen and J. Repke, A Model Approach for the Montan Wax Extraction: Model Development and Experimental Analysis. Separation Science and Technology, 2015, 50: 2311-2326. (IF=1.171) (中科院四区,JCR三区)
(7) C. Xiao, H. Liao, Y. Wang*, J. Li, and W. Zhu*, and Wenhui Zhu, A novel automated heat-pipe cooling device for high-power LEDs, Applied Thermal Engineering, 2017, 111:1320-1329. (IF=3.771)(中科院一区,JCR一区)
(8) F. Wang, X. Ren, P. Zeng, H. Xiao, Y. Wang*, and W. Zhu, Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution. Microelectronic Engineering, (2017). 180: p. 25-29. (IF=2.020)(中科院三区,JCR二区)
(9) F. Wang, P. Zeng, Y. Wang*, X. Ren, H. Xiao, and W. Zhu, High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition. Microelectronic Engineering, (2017). 180: p. 30-34.(IF=2.020)(中科院三区,JCR二区)
(10) F. Wang, X. Ren, Y. Wang*, P. Zeng, Z. Zhou, H. Xiao, and W. Zhu, Parameter analysis on the ultrasonic TSV-filling process and electrochemical characters. Journal of Micromechanics and Microengineering, 2017, 27(10) (IF= 1.888).(中科院三区,JCR二区)
(11) Zhu, Wenhui, K. Wang, and Y. Wang*. A novel model for simulating the racing effect in capillary-driven underfill process in flip chip. Journal of Micromechanics and Microengineering, 2018. 28(4): p. 4500 (IF= 1.888)(中科院三区,JCR二区)
(12) X. Li, H. Konietzky, X. Li, Y. Wang*, Failure pattern of brittle rock governed by initial microcrack characteristics, Acta Geotechnica, 2018.(IF=2.779)(中科院二区,JCR一区)
(13) Houya Wu, Yan Wang*, Zhiyi Li Xiang LiFuliang Wang, Wenhui Zhu*, Experimental Analysis of the Co-deposition of Metal Cu and Nano-sized SiC particles with CTAB in Micro Via Filling, Journal of the Electrochemical Society, 2019. 166(6)(IF=3.662)(中科院二区,JCR一区)
(14) F. Wang, Q. Zhang, W. Liu, Y. Wang*, W. Zhu, Interaction effect of suppressor concentration and current density on the copper deposition rate in TSV filling process, Microelectronic Engineering, 2019, 216: 111022. (IF= 1.888).(中科院三区,JCR二区)
(15) Houya Wu, Zhiyi Li, Yan Wang*, Xiang Li, Wenhui Zhu*,Inhibition Effect of CTAB on Electrodeposition of Cu in Micro Via: Experimental and MD Simulation Investigations, Journal of the Electrochemical Society, 2019, 166:15 (IF=3.662)((中科院二区,JCR一区)