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Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts

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  • Release time:2020-07-06

  • Journal:Journal of Central South University

  • Indexed by:Journal paper

  • Correspondence Author:Jiang Bing-yan, Weng Can*（翁灿）, Zhou Ming-yong, Lv Hui, Drummer Dietmar

  • Volume:23

  • Issue:10

  • Page Number:2536-2541

  • Translation or Not:no

  • Date of Publication:2016-10-05

  • Included Journals:SCI

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  • Postal Address:新校区中铝科技大楼A413

  • Mobile:18711166127

  • Email:canweng@csu.edu.cn
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