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A Method for Fabricating Highly Conductive Paste and Thin Films at Low Temperatrue

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  • Release time:2016-04-19

  • School Sign:中南大学

  • Disigner of the Invention:杨兵初, 阳军亮, 夏兴达, 张祥, 周聪华

  • Type of Patent:Invent

  • State of Patent:Pending patent

  • Application Number:2014102723363

  • Number of Inventors:5

  • Service Invention or Not:no

  • Application Date:2014-06-08

  • First Author:导电薄膜及其制备方法, 一种低温固化的高导电银浆

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