Role of additives in electroless copper plating using hypophosphite as reducing agent
发布时间:2016-07-15
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发表刊物:Surface and Coatings Technology
备注:https://doi.org/10.1016/j.surfcoat.2012.02.006
合写作者:Dou Zhang, Wenbin Hu, Kechao Zhou, Xueping Gan*
文献类型:J
卷号:15
期号:206
页面范围:3405-3409
是否译文:否
发表时间:2012-06-06