Role of additives in electroless copper plating using hypophosphite as reducing agent
发布时间：2016-07-15
点击次数：
发表刊物：Surface and Coatings Technology
备注：https://doi.org/10.1016/j.surfcoat.2012.02.006
合写作者：Dou Zhang, Wenbin Hu, Kechao Zhou, Xueping Gan*
文献类型：J
卷号：15
期号：206
页面范围：3405-3409
是否译文：否
发表时间：2012-06-06
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