中文
  • ZHU WENHUI
  • Doctoral degree
  • Distinguished Professor
  • School of Mechanical and Electrical Engineering
 

Educational Background

  • 1991.41995.1

     National University of Defense Technology   Applied Physics   Doctoral degree   PhD Graduate 

  • 1986.91987.12

     University of Science and Technology of China   Modern Mechanics   Graduate class completion 

  • 1981.91986.7

     University of Science and Technology of China   Modern mechanics   Bachelor's degree   University graduated 

Work Experience

  • 2014.3Now

    Central South University      College of Mechanical and Electrical Engineering of CSU    Professor

  • 2012.32013.5

    Kunshan West Titanium Microelectronics Technology Co., Ltd.      General Manager

  • 2010.42014.2

    Tianshui Huatian Technology Co., LTD      Package and Assembly Technology Research Institute    Chief Engineer

  • 2006.42010.4

    Singapore United Test and Assembly Center Ltd(UTAC)      Science and Technology Research and Development Department    Senior Manager

  • 2004.42006.4

    Cookson Electronics Packaging Materials(Singapore)      R&D Department    Senior scientist

  • 2001.32004.5

    Infineon Technologies Asia Pacific Pte Ltd.      Assembly&Interconnect Technology Department    Senior Engineer

  • 1999.72001.3

    Osaka Prefecture University in Japan      Assistant Professor

  • 1997.71999.6

    Institute of High Performance Computing      Senior Research Engineer

Social Affiliations

  • Adjunct professor of Peking University Microelectronics Research Institute(Shanghai).

  • As a main members to discuss and  formulate strategy of 3D systems integration    industry(2011).

  • ICEPT (HDP) - international conference technical committee chairman (2010-2013) ,  chairman of WLP BBS (2010) and TSV BBS (2011), branch chairman of Simulation and Design  (2008-2010).

  • The key organizing committee members of IEEE EPTC (Singapore)(2006-2009).

  • Reviewer of several international journals, such as Materials Science, Materials Science letters, Packaging Reliability,  and International Journal of Impact Engineering.

  • IEEE member（2006-2011） and ASME member（1999-2006）.

  • Editorial board member of Electronic Packaging Technology and Reliability.

  • Editorial board member of Electronic Packaging and Equipment.

  • Visiting professor of Beijing University of Technology.

  • Member of the first session board of directors of National Center for Advanced Packaging Co., Ltd.

  • 中国封装测试产业创新战略联盟咨询委员会专家

Research Focus

  

Personal Information

Dr. Zhu Wenhui, male, doctor supervisor, is professor with Central South University, China. Chief Scientist of “Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs” which is the 1st National Basic Research Program(973) in 3D IC integration. He was elected as Specially invited “1000 Elite Plan Expert(2011)” of China, top class Talent plan. His main research direction three dimensional integration and testing of nano/micro electronics Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co., member of IEEE and invited professor of Beijing University of Technology. He is a key player of IEEE ICEPT and EPTC conference as organization committee or technical sub-comittee chairman / co-chairman. Dr. Zhu is also reviewer of a few international journals in packaging areas. He has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon, UTAC and Tian Shui Hua Tian / Qtech. Dr. Zhu chaired many key projects in advanced packaging and structural integration such as national 863 project, Chinese natural science fund, and state key technology projects and made great achievements in technology innovation and cost-saving. He has been invited to give keynote talks and short courses in international forums and conferences. Dr. Zhu has published more than 100 technical papers and won 3 times of best paper awards.

  • Distinguished Professor
    Supervisor of Doctorate Candidates
    Supervisor of Master's Candidates
  • Date of Employment:2014-02-01
  • School/Department:School of Mechanical and Electrical Engineering
  • Education Level:PhD Graduate
  • Business Address:新校区机电工程学院C座306
  • Sex:Male
  • Contact Information:15874847749 研究生工作室：湖南省长沙市岳麓区中南大学新校区机电工程学院C座304
  • Degree:Doctoral degree
  • Status:Employed
  • Alma Mater:国防科学技术大学
  • Discipline:Mechanical Engineering
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