Microstructural evolution in adiabatic shear bands of copper at high strain rates: Electron backscatter diffraction characterization
发布时间：2021-10-21
点击次数：
DOI码：10.1016/j.matchar.2011.11.011
发表刊物：Materials Characterization
关键字：Copper; High strain rate; Adiabatic shear band; Electron backscatter diffraction; Dynamic recrystallization
摘要：The microstructural evolution of adiabatic shear bands in annealed copper with different large strains at high strain rates has been investigated by electron backscatter diffraction. The results show that mechanical twinning can occur with minimal contribution to shear localization under dynamic loading. Elongated ultrafine grains with widths of 100–300nm are observed during the evolution of the adiabatic shear bands. A rotational dynamic recrystallization mechanism is proposed to explain the formation of the elongated ultrafine grains.
合写作者：Z.Y. Chen*, C.K. Zhan, X.Y. Yang, C.M. Liu, H.N. Cai
第一作者：L. Tang
论文类型：期刊论文
学科门类：工学
一级学科：材料科学与工程
文献类型：J
卷号：64
页面范围：21-26
ISSN号：1044-5803
是否译文：否
发表时间：2012-02-14
收录刊物：SCI