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A rotationary hot press bonding device and methods

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  • Release time:2017-03-30

  • Patent Applicant:中南大学

  • Disigner of the Invention:杨健等, 吴旺青

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:201610178010.3

  • Service Invention or Not:yes

  • Authorization Date:2018-11-27

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