Preparation of High Strength and High Purity Copper Foil from Waste PCB by Electrochemical Method
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Release time:2021-06-26 Type of Patent:Invent State of Patent:Authorized patents Authorization number:ZL201510282323.9 Service Invention or Not:no -
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 Postal Address:c4a8bac7cd669c4b777bfdba3e9283ab6f5da953e8a51bca55687d8a841d3219890369f69d58ef871911fa8c0534848b5e57733f6a887112be8adc6ec81854cd94cb159497e45f7ef53f2c66ecd186e42721cf295baee93200d1ad7c52129bbe82fcd3aaa1f780ac1140264540843d8de71d57ede5a1542210a5a3c6e8562239 Mobile:99e3c6c8f602db59763687bd9625c41de10bea93005957c686594f71c6e235b5e25fcfa53ef5bc98e56535b57f720174190b291e46071abc70e06d82b72ed659391072d503400dae295c4c95c79074e0469c8b4f64f859e43f95014476d6463e38722483c96e93acb877ca00d84eb55c2c86713bf11dcda9bab3ea20d5187faa Email:7cd9edbaecad90d24787dea81ec17e0bab185a4be78d5a8c4d509b7c927e05aa71f7c20292c56e569bf243b9ba40440c1ca8d7db6e2be348ec0a99b8ad68c0f4e0fdfc02b6b989a4f90394a03309f727af98455723aeb3ce80303fc652900ab1cba08c8997b92caa612d3c223957c0b3af9b1da414f46e34f6a98b9b100c9ada
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