中文

一种低银含量Pb-RE-Ag合金电极

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  • Release time:2016-04-02

  • Patent Applicant:刘业翔, 李劼, 于枭影, 桂俊峰, 郝科涛, 吕晓军, 洪波, 钟晓聪, 蒋良兴, 赖延清

  • Disigner of the Invention:中南大学

  • Type of Patent:Invent

  • State of Patent:Pending patent

  • Application Number:201110433419.2

  • Service Invention or Not:no

  • Application Date:2011-12-23


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