Release time:2016-04-09
Affilication of Author(s):School of Mechanical and Electronical Engineering
School Sign:Central South University
Patent Applicant:李军辉
Disigner of the Invention:李军辉
Patent description:本发明公开了一种用于微电子系统级封装的堆叠芯片悬臂柔性层键合的方法，底层芯片(2)粘接在基板(1)上，上层芯片(3)通过银胶或合金工艺粘接在底层芯片(2)，叠加的上层芯片(3)形成悬臂，上层芯片(3)的I/O焊盘(4)通过微小引线(8)与基板的引脚连接，实现IC封装互连，在键合过程中通过施加高频超声能(5)和键合压力(6)将互连焊球焊接到芯片焊盘(4)上，超声能和键合压力是通过微小焊接劈刀(9)传递能量，在所述的焊盘(4)底层与所述的上层芯片(3)之间设置一层柔性聚合物(7)。
Type of Patent:Invent
State of Patent:Authorized patents
Application Number:2010100055218
Authorization number:CN101764069B
Number of Inventors:8
Service Invention or Not:no
Application Date:2010-01-16
Authorization Date:2011-12-07
First Author:李军辉
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MOBILE Version
