Language : English
Liu Shuhong

Journal Publications

Heat contents of Sc5Si3 and ScSi intermetallics and thermodynamic modeling of the Sc-Si system

Journal:J. Therm. Anal. Calorim.

Co-author:Dandan Liu, Chong Chen, Yong Du, Man Wang, Philip Nash

First Author:Aning Qin

Correspondence Author:Shuhong Liu

Volume:119

Page Number:1315–1321

Translation or Not:no