Language : English
Liu Shuhong

Journal Publications

Thermodynamic assessmentof the Bi-Ni and Bi-Ni-X(X=Ag,Cu) systems

Journal:Journal of Electronic Materials

Co-author:Cong Zhang, Xingxu Lu, Chong Chen, Yong Du

First Author:Yuling Liu

Correspondence Author:Shuhong Liu

Volume:45

Page Number:1041-1056

Translation or Not:no