School Sign:中南大学

Disigner of the Invention:刘祖铭，魏冰，农必重，吕学谦，任亚科，曹镔，艾永康

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:CN202010891102.2

Authorization number:ZL202010891102.2

Service Invention or Not:yes

Pre One:一种消除3D打印镍基高温合金裂纹的方法 Next One:一种提高Cu-Cr-Nb合金强度和电导率的方法