Disigner of the Invention:刘祖铭，何晓宇，黄伯云，刘咏

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:CN200910043114.3

Authorization number:ZL 200910043114.3

Service Invention or Not:yes

Pre One:一种制备多孔非晶态合金块体材料的粉末挤压成形方法