Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts
发布时间:2020-07-06
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发表刊物:Journal of Central South University
论文类型:期刊论文
通讯作者:Jiang Bing-yan, Weng Can*(翁灿), Zhou Ming-yong, Lv Hui, Drummer Dietmar
卷号:23
期号:10
页面范围:2536-2541
是否译文:否
发表时间:2016-10-05
收录刊物:SCI