Distribution Behaviors of As, Sb, Bi, Sn, Se, Te, Au and Ag Between Cu and Liquid Metal Phases in the Cu-Pb Binary System at 500–1080°C
发布时间:2023-01-31
点击次数:
发表刊物:JOM
合写作者:Zhihong Liu, Zhiqian Yu, Huanwen Wang, Xingwu Lu, Leru Zhang
第一作者:Yang Ge
论文类型:期刊论文
通讯作者:Longgong Xia*
卷号:75
期号:5
页面范围:1515-1529
是否译文:否
发表时间:2023-02-03
收录刊物:SCI