中文

一种利用离子液体拆解废电路板并回收焊锡的系统和方法

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  • Release time:2019-01-30

  • Affilication of Author(s):清华大学

  • Patent Applicant:李金惠;董庆银;杨聪仁;谭全银;刘丽丽

  • Type of Patent:Invent

  • Application Number:201811488109.9

  • Service Invention or Not:yes

  • Application Date:2018-12-06


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