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具有三维预留孔结构的硅碳复合负极材料及其制备方法

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  • Release time:2019-01-04

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201210097516.3

  • Service Invention or Not:no

  • Authorization Date:2014-03-12

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