Role of additives in electroless copper plating using hypophosphite as reducing agent

Release time:2016-07-15

Journal:Surface and Coatings Technology

Note:https://doi.org/10.1016/j.surfcoat.2012.02.006

Co-author:Dou Zhang, Wenbin Hu, Kechao Zhou, Xueping Gan*

Document Type:J

Volume:15

Issue:206

Page Number:3405-3409

Translation or Not:no

Date of Publication:2012-06-06