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金刚石基超宽禁带半导体材料与高功率IGBT模块封装材料的研发

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  • Release time:2024-01-05

  • Affiliation of Participant(s):粉末冶金研究院

  • Supported by:中科前沿科技研究有限公司

  • Type of Project:技术开发(科技)

  • Nature of Project:横向

  • Project Number:H202105170330001

  • Date of Project Completion:2023-12-31

  • Date of Project Initiation:2021-04-01

  • Subsidy Amount:50.0

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