Language : English
ZHENG Yu

Patents

一种耦合封装硅光子芯片

Affilication of Author(s):中南大学

School Sign:中南大学

Patent Applicant:中南大学

Disigner of the Invention:郑煜 郜飘飘 夏冰心 吴雄辉 开小超 严一雄 段吉安

Patent description:ZL201711217229.0

Note:2018-05-15 实质审查的生效IPC(主分类):G02B 6/42申请日:20171128 2018-04-20 公开

Type of Patent:Invent

State of Patent:Authorized patents

Service Invention or Not:no

First Author:郑煜