Language : English
ZHENG Yu

Patents

一种用于大功率半导体激光器封装的散热装置及方法

Affilication of Author(s):中南大学

Patent Applicant:中南大学

Disigner of the Invention:严一雄 郑煜 段吉安

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:201811080333.4

Authorization number:ZL201811080333.4

Service Invention or Not:no