Affilication of Author(s):中南大学

School Sign:中南大学

Type of Patent:Invent

State of Patent:Pending patent

Application Number:202110786773.7

Service Invention or Not:yes

Pre One:一种硅光子芯片光耦合结构加工方法及结构 Next One:一种光纤与光波导耦合的方法、结构和晶圆测试方法