Microstructural evolution in adiabatic shear bands of copper at high strain rates: Electron backscatter diffraction characterization

Release time:2021-10-21

DOI number:10.1016/j.matchar.2011.11.011

Journal:Materials Characterization

Key Words:Copper; High strain rate; Adiabatic shear band; Electron backscatter diffraction; Dynamic recrystallization

Abstract:The microstructural evolution of adiabatic shear bands in annealed copper with different large strains at high strain rates has been investigated by electron backscatter diffraction. The results show that mechanical twinning can occur with minimal contribution to shear localization under dynamic loading. Elongated ultrafine grains with widths of 100–300nm are observed during the evolution of the adiabatic shear bands. A rotational dynamic recrystallization mechanism is proposed to explain the formation of the elongated ultrafine grains.

Co-author:Z.Y. Chen*, C.K. Zhan, X.Y. Yang, C.M. Liu, H.N. Cai

First Author:L. Tang

Indexed by:Journal paper

Discipline:Engineering

First-Level Discipline:Materials Science and Engineering

Document Type:J

Volume:64

Page Number:21-26

ISSN No.:1044-5803

Translation or Not:no

Date of Publication:2012-02-14

Included Journals:SCI