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HOU Wenqi

Patents

一种基于复合嵌套结构的电磁准零刚度隔振装置及方法

Affilication of Author(s):中南大学

Disigner of the Invention:孙绮, Savior Shedman, 国巍, 徐磊, 伍军, 余志武, 曾俊扬

Type of Patent:Invent

State of Patent:Authorized patents

Application Number:202511528162.7

Number of Inventors:8

Service Invention or Not:no

First Author:侯文崎