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A micro-fluidic chip injection molding and bonding mold

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  • Release time:2016-04-13

  • Affilication of Author(s):Central South University

  • School Sign:Central South University

  • Patent Applicant:中南大学

  • Disigner of the Invention:周洲, 楚纯朋, 蒋炳炎

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Application Number:CN201010542724.0

  • Number of Inventors:3

  • Service Invention or Not:no

  • Application Date:2010-11-12

  • Publication Date:2011-05-18

  • First Author:蒋炳炎

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