中文

Interface response and microstructure formation mechanism of high frequency thermo acoustic flip chip bonding with hard copper bump

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  • Release time:2016-04-09

  • Affiliation of Participant(s):Central South University

  • Teaching and Research Group:State Key Laboratory of High Performance Complex M

  • Leading Scientist:李军辉

  • Status:understudied

  • Note:2013.1-2016.12

  • Supported by: National Natural Science Foundation of China

  • Type of Research Outcome:Thesis

  • Classification of Project: National Natural science Fund Project

  • Nature of Project:Application of basic and applied technology research

  • Project Number:51275536

  • Classification of Disciplines:机械工程

  • Date of Project Approval:2012-07-20

  • Scheduled completion time:2016-12-30

  • Date of Project Completion:2016-12-30

  • Date of Project Initiation:2013-01-01


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