中文

Chip copper bonding interface formation mechanism and laws of microstructure research

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  • Release time:2016-04-09

  • Affiliation of Participant(s):Central South University

  • Leading Scientist:李军辉

  • Status:completed

  • Supported by:National Natural Science Foundation of China

  • Type of Research Outcome:Thesis

  • Classification of Project:National Natural science Fund Project

  • Nature of Project:Application of basic and applied technology research

  • Project Number:50975292

  • Classification of Disciplines:机械工程

  • Scheduled completion time:2012-12-27

  • Date of Project Completion:2012-12-27

  • Date of Project Initiation:2010-01-01


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