中文
Home > Patents

一种利用离子液体拆解废电路板并回收焊锡的系统和方法

Hits:

  • Release time:2019-01-30

  • Affilication of Author(s):清华大学

  • Patent Applicant:李金惠；董庆银；杨聪仁；谭全银；刘丽丽

  • Type of Patent:Invent

  • Application Number:201811488109.9

  • Service Invention or Not:yes

  • Application Date:2018-12-06

  •

Central South University  All rights reserved  湘ICP备05005659号-1 Click:
  MOBILE Version

The Last Update Time:..