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Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

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  • Release time:2016-04-28

  • Journal:Journal of Electronic Packaging

  • Co-author:Wenhui Zhu, Tong An, Cha Gao, Fei Qin, Guofeng Xia

  • Document Type:J

  • Volume:135

  • Issue:4

  • Page Number:119-132

  • Translation or Not:no

  • Date of Publication:2013-01-01

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