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多圈排列无载体IC芯片封装件及其生产方法

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  • Release time:2016-04-28

  • Disigner of the Invention:郭小伟, 李习周, 慕蔚, 朱文辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201110181828.8

  • Service Invention or Not:no

  • Authorization Date:2014-04-30

  • First Author:朱文辉

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