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中心布线双圈排列单IC芯片封装件及其制备方法

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  • Release time:2016-04-28

  • Disigner of the Invention:李习周, 慕蔚, 郭小伟, 朱文辉

  • Type of Patent:Invent

  • State of Patent:Authorized patents

  • Authorization number:ZL201110454999.3

  • Service Invention or Not:no

  • Authorization Date:2015-06-17

  • First Author:朱文辉

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