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集成光子器件的耦合封装工艺与设备

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  • Release time:2021-12-20

  • Status:已结题

  • Supported by:国家科学技术部高技术研究发展中心

  • Type of Research Outcome:New Technology & New Process

  • Classification of Project:863 plan

  • Sub-Class of Project:863

  • Nature of Project:863 Advanced manufacturing

  • Supported by:The 863 Program

  • Project level:National

  • Subsidy Amount:230.0

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