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Multi domain energy transfer and bond formation in the thin chip stack interconnection

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Release time:2016-04-09
Affiliation of Participant(s):Central South University
Status:Completed
Supported by:Ministry of Science and Technology
Type of Research Outcome:Thesis
Classification of Project:National Basic Research Program of China(973 program)
Project Number:2009CB724203
Classification of Disciplines:机械工程
Date of Project Completion:2013-12-30
Date of Project Initiation:2009-01-01

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