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SiOC flims on C/C composite prepared by chemical vapor deposition with hexamethyldisilazane precursor

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  • Release time:2022-04-13

  • DOI number:10.1016/j.ceramint.2022.04.079

  • Journal:ceramics International

  • Key Words:Silicon oxycarbide CVD Hexamethyldisilazane (HMDSN) Microstructure Chemical composition

  • Abstract:Silicon oxycarbide (SiOC) fflms on C/C composite substrate were prepared by isothermal chemical vapor deposition (CVD) with hexamethyldisilazane (HMDSN) as precursor. The deposition rate, microstructure, composition and mechanical properties of fflms prepared at deposition temperature ranging from 1300 K to 1576 K were investigated in details. With increasing deposition temperature, deposition rate increased gradually and reached a maximum value of 42.9 μm/h at 1513 K and then decreased; concurrently, the surface morphology of SiOC fflm changed from a smooth-dense to a coarse cauliffower, and then into a needle-like granular morphology. The SiOC fflms were composed of dominant SiC and a few other phases at all temperatures. In addition, the contents of oxygen-enriched units SiO3C and SiO2 increased with deposition temperature due to redistribution reaction of Si–O and Si–C bonds and oxidation. SiOC fflms prepared at 1373 K showed the highest hardness and elastic modulus for 28.8 GPa and 234.2 GPa, respectively. SiOC fflms also contained small amounts of Si3N4 and SiCN at all conditions.

  • Indexed by:Article

  • Discipline:Engineering

  • Document Type:J

  • Volume:48

  • Issue:14

  • Page Number:20887-20894

  • Translation or Not:no

  • Date of Publication:2022-04-13

  • Included Journals:SCI


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  • SiOC films on CC composite prepared by chemical vapor deposition with吴秀美.pdf   
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