Journal:Optik

Co-author:Chen Weiqun, Bao Zhipeng

First Author:Zhou Can

Indexed by:Journal paper

Correspondence Author:Deng Guiling

Volume:183

Page Number:273-276

Translation or Not:no

Pre One:A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging Next One:Temperature prediction approach of piezo stacks used in jet valve