Language : English
周灿

Journal Publications

A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging

Journal:IEEE Transactions on Industrial Informatics

Co-author:Zhang Haoliang, Chen Zhuo, Chen Xinxin, Long Zhili, Liu Xiaohe, Zhu Wenhui

First Author:Li Junhui

Indexed by:Journal paper

Correspondence Author:Zhou Can

Volume:15

Issue:7

Page Number:3808-3820

Translation or Not:no