The evolution mechanism of physical properties at the micro-interconnect interface and collaborative design of the entire physical process based on manufacturing and serving

Release time:2016-04-28

Affiliation of Participant(s):Central South University

Leading Scientist:朱文辉

Note:the 6th project of Fundamental Research on Wafer-Level 3D Integration for 20/14nm ICs.

Supported by:Ministry of Science and Technology of the People's Republic of China

Type of Project:国家重点基础研究发展计划（973计划）

Nature of Project:Fundamental research

Project Number:2015CB057206

Date of Project Approval:2015-01-01

Scheduled completion time:2019-08-31